Thermal silica gel has excellent thermal conductivity. It can quickly conduct away the heat generated by electronic equipment when it is working, avoid heat accumulation and overheating of the equipment, and thus ensure the stable operation and service life of the equipment. Its efficient thermal conductivity comes from its special structure and composition.
This material usually has good flexibility and elasticity. It can easily fill the gaps between various electronic components and heat dissipation devices to ensure that heat can be transferred evenly and quickly. Whether between the CPU and the radiator of the computer or in other precision electronic equipment, Thermal silica gel can play a key role.
In practical applications, Thermal silica gel has shown many advantages. It has low thermal resistance and can minimize the loss of heat during the transfer process. At the same time, it also has good insulation properties to ensure that it will not cause interference or short circuit problems to the circuit of the electronic equipment while conducting heat.
In addition, Thermal silica gel also has certain temperature resistance. It can maintain stable performance in a wide temperature range and adapt to the needs of different working environments. Moreover, its chemical properties are relatively stable, not easy to age and deteriorate, and has a long service life.
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Thermal silica gel
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